We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for On-board development kit.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

On-board development kit - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

On-board development kit Product List

1~5 item / All 5 items

Displayed results

NVIDIA Jetson Nano GPU-equipped AI development kit

ADLINK, equipped with Jetson Nano GPU, 8-megapixel MIPI color sensor (30fps, rolling shutter)

【ADLINK AI Camera Dev Kit Features】 ■ Compact smart camera equipped with NVIDIA Jetson Nano SoC, ideal for AI PoC development ■ 8-megapixel MIPI color sensor (30fps, rolling shutter) ■ Pre-installed EVA software allows for labeling, training, and inference via GUI (no programming required) ■ Comes with sample code and verified drivers, enabling immediate development start ■ All-in-one design simplifies wiring, installation, and maintenance ■ Single USB Type-C port supports power, video, and data communication ■ Equipped with abundant I/O interfaces including 4×DI, 4×DO, LAN, COM, etc.

  • スクリーンショット 2025-07-03 172650.png
  • VPN/Wide Area Ethernet
  • On-board development kit

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

NXP i.MX93 equipped development kit: I-Pi OSM IMX93

NXP i.MX 93 Dual-Core Arm Cortex-A55 & M33 Based I-Pi OSM Development Kit

The I-Pi OSM IMX93 is an OSM-based smart solution development kit equipped with the NXP i.MX 93 (dual-core Arm Cortex-A55 & Arm Cortex-M33) processor and the in-SoC Arm Ethos-U65 microNPU (Neural Processing Unit). This is the first OSM R1.1 low-power development kit specifically designed for robust industrial embedded applications that require long life, high MTBF, and strict revision management. With a robust solderable design, compact size, and compatibility with pick-and-place machines, OSM can achieve many of the advantages of custom SBCs without making large engineering investments. This module features the power-efficient NXP i.MX 93 series SoC integrated with the in-SoC Arm Ethos-U65 microNPU, providing unparalleled flexibility, rich connectivity, and high scalability for compact edge applications.

  • Embedded Board Computers
  • On-board development kit

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

MediaTek-equipped development kit [I-PI OSM 510]

MediaTek Genio 510 series processor equipped OSM development kit

The ADLINK I-Pi OSM-510 development kit is based on the OSM-MTK510 computer-on-module and is designed to accelerate the development and evaluation of next-generation edge AI and embedded applications. Compliant with the compact OSM R1.2 standard, this kit provides a ready-to-use hardware platform that integrates processing power, connectivity, and essential I/O. Developers can quickly set up their systems without the hassle of complex custom board designs. Based on the power-efficient MediaTek Genio 510 AI-enabled SoC, the I-Pi OSM-510 enables efficient on-device inference for vision, multimedia, and intelligent edge workloads. The I-Pi OSM-510 development kit is optimized for rapid prototyping and early proof-of-concept development, helping engineers shorten time to market while maintaining a clear path to production.

  • Embedded Board Computers
  • On-board development kit

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

COM Express Type 10 Elkhart Lake

COM Express Type 10 development kit equipped with Intel 6th generation Atom x6211E dual-core SoC.

The COM Express Type 10 Elkhart Lake is a COM Express Type 10-based edge solution development kit equipped with the Intel Atom x6211E dual-core SoC, which integrates Intel UHD graphics and comprehensive high-speed interfaces. Additionally, this kit, specialized for development, supports the latest version of the Intel Distribution of OpenVINO toolkit, featuring more deep learning models, higher inference performance, and fewer code changes, enabling simpler development than ever before. With 4GB LPDDR4 and 64GB eMMC memory, the COM Express Type 10 Elkhart Lake supports an extended temperature range within a low power envelope, making it a key component essential for the development and prototyping of mission-critical fanless industrial IoT applications where safety and reliability are always paramount.

  • Embedded Board Computers
  • On-board development kit

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

NXP i.MX95 equipped development kit: I-Pi OSM IMX95

NXP i.MX 95 SoC equipped I-Pi OSM development kit

The ADLINK I-Pi OSM IMX95 development kit is an industrial-grade, immediately available platform designed to quickly initiate prototyping and software validation for next-generation edge AI and IoT applications. It is centered around the high-performance NXP i.MX 95 application processor and combines a feature-rich 4-inch reference carrier board with ADLINK's highly efficient 45x45mm OSM-IMX95. This evaluation system, which integrates edge AI and powerful graphics processing capabilities, enables developers to immediately build and benchmark advanced vision analytics, smart automation routines, and deterministic robot control loops after deployment. The standout feature of this development platform is its adoption of the advanced Open Standard Module (OSM) architecture. The OSM module utilizes a soldered Size-L BGA form factor, eliminating mechanical weaknesses, increased weight, and additional costs often associated with traditional board-to-board connectors.

  • Embedded Board Computers
  • On-board development kit

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration